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The 4900P No Clean Solder Paste is made from a blend of high-purity, non-recycled tin, silver, and copper metal powder mixed with a no clean flux. This lead-free and halogen-free solder paste is designed for extreme flux activity and enhanced printing characteristics needed for ultra-fine pitch applications. It provides excellent wetting on copper OSP-coatings. Wide reflow process windows combined with high thermal stability yield solder joints with smooth surfaces.

Applications & Usages

The solder paste is designed to accommodate high speed printing. It can yield brick-like prints even when using an ultra-fine pitch stencils down to 0.3 mm.

 

Catalog Number Sizes Available Description
4900P-25G 25 g (0.88 oz) Syringe
4900P-250G 250 g (8.81 oz) Jar
Features
  • Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
  • Flux meets J-STD-004B
  • Repeatable and consistent print characteristics
  • Long stencil and tack life to accommodate high speed printing
  • Excellent wettability
  • Suitable for air or nitrogen atmosphere
  • Medium soft, non-cracking residues
  • Dobb-Frank (DRC conflict free)
  • REACH (compliant)
  • RoHS (compliant)

Safety Data Sheet
Technical Data Sheet